Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

0.031"" (0.79mm)

Flux Type :

No-Clean, Water Soluble

Form :

Spool, 1 oz (28.35g)

Melting Point :

423 ~ 428°F (217 ~ 220°C)

Part Status :

Active

Process :

Lead Free

Shelf Life :

-

Shelf Life Start :

-

Storage/Refrigeration Temperature :

-

Type :

Wire Solder

Wire Gauge :

20 AWG, 22 SWG