Product overview

Product number
40-6574-10
Existing quantity
7
manufacturer
Aries Electronics
Product Category
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET ZIF 40POS TIN

Product Details

Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
200.0µin (5.08µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyphenylene Sulfide (PPS), Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
40 (2 x 20)
Operating Temperature :
-
Part Status :
Active
Pitch - Mating :
0.100"" (2.54mm)
Pitch - Post :
0.100"" (2.54mm)
Termination :
Solder
Type :
DIP, ZIF (ZIP), 0.6"" (15.24mm) Row Spacing

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