Product overview
- Product number
- TC1-200G
- Existing quantity
- 3
- manufacturer
- Chip Quik Inc.
- Product Category
- Thermal - Adhesives, Epoxies, Greases, Pastes
- product description
- HEAT SINK COMPOUND - HIGH DENSIT
Product Details
- Color :
- White
- Features :
- -
- Part Status :
- Active
- Shelf Life :
- 60 Months
- Size / Dimension :
- 200 gram Jar
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Thermal Conductivity :
- 0.67W/m-K
- Type :
- Silicone Compound
- Usable Temperature Range :
- -
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