Attachment Method :

Thermal Tape, Adhesive (Included)

Diameter :

-

Height Off Base (Height of Fin) :

0.189"" (4.80mm)

Length :

0.520"" (13.20mm)

Material :

Copper

Material Finish :

-

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Part Status :

Active

Power Dissipation @ Temperature Rise :

-

Shape :

Rectangular

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

Top Mount

Width :

0.480"" (12.19mm)