Architecture :

MCU, FPGA

Connectivity :

EBI/EMI, I²C, SPI, UART/USART

Core Processor :

ARM® Cortex®-M3

Flash Size :

128KB

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

256-LBGA

Part Status :

Obsolete

Peripherals :

DMA, POR, WDT

Primary Attributes :

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

RAM Size :

16kB

Speed :

80MHz

Supplier Device Package :

256-FPBGA (17x17)