Architecture :

MCU, FPGA

Connectivity :

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size :

-

Operating Temperature :

0°C ~ 85°C (TJ)

Package / Case :

900-BBGA, FCBGA

Part Status :

Obsolete

Peripherals :

DMA

Primary Attributes :

Kintex™-7 FPGA, 350K Logic Cells

RAM Size :

256kB

Speed :

800MHz

Supplier Device Package :

900-FCBGA (31x31)