Architecture :

MCU, FPGA

Connectivity :

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size :

-

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

900-BBGA, FCBGA

Part Status :

Active

Peripherals :

DMA, WDT

Primary Attributes :

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

RAM Size :

256kB

Speed :

533MHz, 600MHz, 1.3GHz

Supplier Device Package :

900-FCBGA (31x31)