Product overview

Product number
BGA0034-S
Existing quantity
20
manufacturer
Chip Quik Inc.
Product Category
Solder Stencils, Templates
product description
BGA-676 (1.0 MM PITCH, 26 X 26 G

Product Details

Inner Dimension :
1.024"" L x 1.024"" W (26.00mm x 26.00mm)
Material :
Stainless Steel
Number of Positions :
676
Outer Dimension :
2.600"" L x 1.800"" W (66.04mm x 45.72mm)
Part Status :
Active
Pitch :
0.039"" (1.00mm)
Thermal Center Pad :
-
Type :
BGA

Purchases and prices

You may be looking for

Recommended Products

Online service
Hotline
0512-57509905