Product overview

Product number
BGA0030-S
Existing quantity
9
manufacturer
Chip Quik Inc.
Product Category
Solder Stencils, Templates
product description
BGA-36 (0.5 MM PITCH, 6 X 6 GRID

Product Details

Inner Dimension :
-
Material :
Stainless Steel
Number of Positions :
36
Outer Dimension :
1.300"" L x 0.900"" W (33.02mm x 22.86mm)
Part Status :
Active
Pitch :
0.020"" (0.50mm)
Thermal Center Pad :
-
Type :
BGA

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