Product overview

Product number
BMI-C-007-01
Existing quantity
4,600
manufacturer
Laird Technologies EMI
Product Category
RFI and EMI - Contacts, Fingerstock and Gaskets
product description
CONTACT BECU 3.3X1.0MM

Product Details

Attachment Method :
Solder
Height :
0.126"" (3.20mm)
Length :
0.130"" (3.30mm)
Material :
Beryllium Copper
Operating Temperature :
-
Part Status :
Active
Plating :
Tin
Plating - Thickness :
-
Shape :
-
Type :
Shield Finger
Width :
0.059"" (1.50mm)

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