- 品牌:
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- Bergquist (14)
- CUI Devices (24)
- Parker Chomerics (18)
- t-Global Technology (78)
- Part Status:
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- Type:
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- Thickness:
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- Usage:
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- Thermal Conductivity:
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- Outline:
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- Backing, Carrier:
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- Thermal Resistivity:
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139 条记录
图片 | 型号 | 品牌 | 描述 | 参考价格 | 起订量 | 参考库存 | 操作 |
---|---|---|---|---|---|---|---|
|
Bergquist | THERM PAD 406.4MMX2... |
|
1 | 7 | 加入购物车 提交询价 | |
|
Parker Chomerics | THERM-A-GAP G974 5W... |
|
1 | 20 | 加入购物车 提交询价 | |
|
Parker Chomerics | CHO-THERM 1674 TO-22... |
|
1 | 337 | 加入购物车 提交询价 | |
|
t-Global Technology | THERM PAD 288MMX192... |
|
1 | 6 | 加入购物车 提交询价 | |
|
t-Global Technology | THERM PAD 288MMX192... |
|
1 | 14 | 加入购物车 提交询价 | |
|
t-Global Technology | THERM PAD 288MMX192... |
|
1 | 19 | 加入购物车 提交询价 | |
|
Parker Chomerics | THERM-A-GAP 974 9X12... |
|
1 | 14 | 加入购物车 提交询价 | |
|
t-Global Technology | THERMAL PAD 190X140... |
|
1 | 8 | 加入购物车 提交询价 | |
|
t-Global Technology | THERMAL PAD 190X140... |
|
1 | 核实库存 | 提交询价 | |
|
Parker Chomerics | CHO-THERM 1674 TO-22... |
|
1,000 | 核实库存 | 提交询价 | |
|
CUI Devices | THERMAL INTERFAC... |
|
18 | 核实库存 | 提交询价 | |
|
CUI Devices | THERMAL INTERFAC... |
|
17 | 核实库存 | 提交询价 | |
|
CUI Devices | THERMAL INTERFAC... |
|
17 | 核实库存 | 提交询价 | |
|
Bergquist | THERM PAD 406.4MMX2... |
|
50 | 核实库存 | 提交询价 | |
|
Parker Chomerics | CHO-THERM 1674 0.010" ... |
|
1 | 361 | 加入购物车 提交询价 | |
|
Parker Chomerics | CHO-THERM 1674 0.010" ... |
|
1 | 495 | 加入购物车 提交询价 | |
|
Bergquist | THERM PAD 406.4MMX2... |
|
1 | 95 | 加入购物车 提交询价 | |
|
Gelid Solutions LLC | THERMAL PAD 120X20X... |
|
1 | 核实库存 | 提交询价 | |
|
Gelid Solutions LLC | THERMAL PAD 120X20X... |
|
1 | 核实库存 | 提交询价 | |
|
Gelid Solutions LLC | THERMAL PAD 90X50X... |
|
1 | 核实库存 | 提交询价 |