Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

20.0µin (0.51µm)

Contact Finish Thickness - Post :

20.0µin (0.51µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Carrier, Closed Frame

Housing Material :

Aluminum Alloy

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

24 (2 x 12)

Operating Temperature :

-55°C ~ 125°C

Part Status :

Obsolete

Pitch - Mating :

0.100"" (2.54mm)

Pitch - Post :

0.100"" (2.54mm)

Termination :

Solder

Type :

DIP, 0.6"" (15.24mm) Row Spacing