Contact Finish - Mating :

Tin-Lead

Contact Finish - Post :

Tin-Lead

Contact Finish Thickness - Mating :

200.0µin (5.08µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Open Frame

Housing Material :

Polyethersulfone (PES), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

100 (4 x 25)

Operating Temperature :

0°C ~ 105°C

Part Status :

Obsolete

Pitch - Mating :

-

Pitch - Post :

-

Termination :

Solder

Type :

QFP