Architecture :

MCU, FPGA

Connectivity :

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Core Processor :

ARM® Cortex®-M3

Flash Size :

512KB

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

676-BGA

Part Status :

Obsolete

Peripherals :

DDR, PCIe, SERDES

Primary Attributes :

FPGA - 90K Logic Modules

RAM Size :

64kB

Speed :

166MHz

Supplier Device Package :

676-FBGA (27x27)