Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

-

Flux Type :

No-Clean

Form :

Jar, 8.8 oz (250g)

Melting Point :

423 ~ 428°F (217 ~ 220°C)

Part Status :

Active

Process :

Lead Free

Shelf Life :

6 Months, 2 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

37°F ~ 46°F (3°C ~ 8°C)

Type :

Solder Paste

Wire Gauge :

-