Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

-

Flux Type :

No-Clean

Form :

Jar, 0.53 oz (15g)

Melting Point :

423 ~ 428°F (217 ~ 220°C)

Part Status :

Active

Process :

Lead Free

Shelf Life :

24 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

37°F ~ 77°F (3°C ~ 25°C)

Type :

Solder Paste, Two Part Mix

Wire Gauge :

-