Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

0.020"" (0.51mm)

Flux Type :

No-Clean

Form :

Spool, 4 oz (113.40g)

Melting Point :

430°F (221°C)

Part Status :

Active

Process :

Lead Free

Shelf Life :

-

Shelf Life Start :

-

Storage/Refrigeration Temperature :

-

Type :

Wire Solder

Wire Gauge :

24 AWG, 25 SWG