Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

0.012"" (0.31mm)

Flux Type :

-

Form :

Jar

Melting Point :

423 ~ 428°F (217 ~ 220°C)

Part Status :

Active

Process :

Lead Free

Shelf Life :

24 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

-

Type :

Solder Sphere

Wire Gauge :

-