产品概览
产品详情
- Board Thickness :
- 0.062"" (1.57mm) 1/16
- Material :
- FR4 Epoxy Glass
- Number of Positions :
- 36
- Package Accepted :
- PowerSOIC, PSOP, HSOP
- Part Status :
- Active
- Pitch :
- 0.026"" (0.65mm)
- Proto Board Type :
- SMD to DIP
- Size / Dimension :
- 1.000"" x 2.000"" (25.40mm x 50.80mm)
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