Product overview

Product number
840-AG10D
Existing quantity
562
manufacturer
TE Connectivity AMP Connectors
Product Category
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET 40POS GOLD

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
-
Contact Finish Thickness - Mating :
25.0µin (0.63µm)
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
-
Features :
Open Frame
Housing Material :
Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
40 (2 x 20)
Operating Temperature :
-55°C ~ 105°C
Part Status :
Active
Pitch - Mating :
0.100"" (2.54mm)
Pitch - Post :
0.100"" (2.54mm)
Termination :
Solder
Type :
DIP, 0.6"" (15.24mm) Row Spacing

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