Product overview

Product number
BU180Z-178-HT
Existing quantity
26
manufacturer
On Shore Technology Inc.
Product Category
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET 18POS GOLD

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
Copper
Contact Finish Thickness - Mating :
78.7µin (2.00µm)
Contact Finish Thickness - Post :
Flash
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
18 (2 x 9)
Operating Temperature :
-55°C ~ 125°C
Part Status :
Active
Pitch - Mating :
0.100"" (2.54mm)
Pitch - Post :
0.100"" (2.54mm)
Termination :
Solder
Type :
DIP, 0.3"" (7.62mm) Row Spacing

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