Product overview

Product number
DILB18P-223TLF
Existing quantity
6,405
manufacturer
Amphenol ICC (FCI)
Product Category
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET 18POS TINLEAD

Product Details

Contact Finish - Mating :
Tin-Lead
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Mating :
100.0µin (2.54µm)
Contact Finish Thickness - Post :
100.0µin (2.54µm)
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Open Frame
Housing Material :
Polyamide (PA), Nylon
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
18 (2 x 9)
Operating Temperature :
-55°C ~ 125°C
Part Status :
Active
Pitch - Mating :
0.100"" (2.54mm)
Pitch - Post :
0.100"" (2.54mm)
Termination :
Solder
Type :
DIP, 0.3"" (7.62mm) Row Spacing

Purchases and prices

Online service
Hotline
0512-57509905