Product overview

Product number
828-AG11D
Existing quantity
399
manufacturer
TE Connectivity AMP Connectors
Product Category
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET 28POS GOLD

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Mating :
25.0µin (0.63µm)
Contact Finish Thickness - Post :
80.0µin (2.03µm)
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Open Frame
Housing Material :
Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
28 (2 x 14)
Operating Temperature :
-55°C ~ 105°C
Part Status :
Active
Pitch - Mating :
0.100"" (2.54mm)
Pitch - Post :
0.100"" (2.54mm)
Termination :
Solder
Type :
DIP, 0.6"" (15.24mm) Row Spacing

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