Product overview

Product number
D0806-01
Existing quantity
0
manufacturer
Harwin Inc.
Product Category
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET 6POS GOLD

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Finish Thickness - Post :
196.9µin (5.00µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
6 (2 x 3)
Operating Temperature :
-55°C ~ 125°C
Part Status :
Obsolete
Pitch - Mating :
0.100"" (2.54mm)
Pitch - Post :
0.100"" (2.54mm)
Termination :
Wire Wrap
Type :
DIP, 0.3"" (7.62mm) Row Spacing

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