Attachment Method :

SMD Pad

Diameter :

-

Height Off Base (Height of Fin) :

0.375"" (9.52mm)

Length :

0.590"" (15.00mm)

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-263 (D²Pak)

Part Status :

Obsolete

Power Dissipation @ Temperature Rise :

2.0W @ 40°C

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

5.00°C/W @ 400 LFM

Thermal Resistance @ Natural :

-

Type :

Board Level

Width :

1.020"" (25.91mm)