Attachment Method :

-

Diameter :

-

Height Off Base (Height of Fin) :

-

Length :

-

Material :

-

Material Finish :

-

Package Cooled :

FPGA

Part Status :

Active

Power Dissipation @ Temperature Rise :

-

Shape :

-

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

Top Mount

Width :

-