Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

0.032"" (0.81mm)

Flux Type :

No-Clean

Form :

Spool, 4 oz (113.40g)

Melting Point :

423 ~ 430°F (217 ~ 221°C)

Part Status :

Active

Process :

Lead Free

Shelf Life :

60 Months

Shelf Life Start :

-

Storage/Refrigeration Temperature :

65°F ~ 80°F (18°C ~ 27°C)

Type :

Wire Solder

Wire Gauge :

20 AWG, 21 SWG