Product overview

Product number
DE02018
Existing quantity
0
manufacturer
Dreyer Electronics LLC
Product Category
Adapter, Breakout Boards
product description
SOP-18/SSOP-18/SOIC-18 TO DIP-18

Product Details

Board Thickness :
0.063"" (1.60mm)
Material :
FR4 Epoxy Glass
Number of Positions :
18
Package Accepted :
SOIC, SOP, SSOP
Part Status :
Active
Pitch :
0.100"" (2.54mm)
Proto Board Type :
SMD to DIP
Size / Dimension :
0.905"" L x 0.744"" W (23.00mm x 18.90mm)

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