Product overview

Product number
BDN11-3CB/A01
Existing quantity
610
manufacturer
CTS Thermal Management Products
Product Category
Thermal - Heat Sinks
product description
HEATSINK CPU W/ADHESIVE 1.11"SQ

Product Details

Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.355"" (9.02mm)
Length :
1.110"" (28.19mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Part Status :
Active
Power Dissipation @ Temperature Rise :
-
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
7.20°C/W @ 400 LFM
Thermal Resistance @ Natural :
20.90°C/W
Type :
Top Mount
Width :
1.110"" (28.19mm)

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