Architecture :

MCU, FPGA

Connectivity :

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Core Processor :

ARM® Cortex®-M3

Flash Size :

256kB

Operating Temperature :

0°C ~ 85°C (TJ)

Package / Case :

256-LBGA

Part Status :

Active

Peripherals :

DMA, POR, WDT

Primary Attributes :

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

RAM Size :

64kB

Speed :

100MHz

Supplier Device Package :

256-FPBGA (17x17)