Attachment Method :

Press Fit

Diameter :

-

Height Off Base (Height of Fin) :

2.000"" (50.80mm)

Length :

2.000"" (50.80mm)

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

Stud Mounted Semiconductor Cases

Part Status :

Active

Power Dissipation @ Temperature Rise :

15.0W @ 70°C

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

2.50°C/W @ 250 LFM

Thermal Resistance @ Natural :

-

Type :

Board Level, Vertical

Width :

0.750"" (19.05mm)