Attachment Method :

SMD Pad

Diameter :

-

Height Off Base (Height of Fin) :

0.400"" (10.16mm)

Length :

0.315"" (8.00mm)

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-252 (DPAK)

Part Status :

Obsolete

Power Dissipation @ Temperature Rise :

2.5W @ 35°C

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

17.50°C/W @ 300 LFM

Thermal Resistance @ Natural :

-

Type :

Top Mount

Width :

0.900"" (22.86mm)