产品概览
产品详情
- Board Thickness :
- 0.063"" (1.60mm)
- Material :
- FR4 Epoxy Glass
- Number of Positions :
- 18
- Package Accepted :
- SOIC, SOP, SSOP
- Part Status :
- Active
- Pitch :
- 0.100"" (2.54mm)
- Proto Board Type :
- SMD to DIP
- Size / Dimension :
- 0.905"" L x 0.744"" W (23.00mm x 18.90mm)
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